Flex-Rigld PCB
Swipe screen to view More| Substrate | PI + Ra/ED Copper | OK |
|---|---|---|
| Size | Board Size | (250 mm × 500 mm) |
| Board Thickness | Flex：0.1~0.3 mm | |
| Rigid-Flex：0.6~2.4 mm | ||
| Trace | Width/Spacing | Min. 2.5/2.5 mil |
| Copper Thickness | Max. 2 OZ | |
| Min. 1/3 OZ | ||
| Flex Board Thickness | Max. Thickness 3mil | |
| Min. Thicnkess 0.5mil | ||
| Lamination | Number of Layers | Flex Board：1L~8L |
| Flex-Rigid：Max. 8L | ||
| Drilling | Machine Drill Aperture Width | Min. 4mil (0.1mm) |
| Aperture With Tolerance | ±0.05mm | |
| Aperture Width Offset | ±0.05mm | |
| Laser Drill | Min. 4mil (0.1mm) | |
| Plating | Aspect Ratio | 1:8 |
| COVER LAYER/背膠/Stiffener/Laminate | Cover Layer Laminate Tolerance | ± 8 mil (0.2mm) |
| 背膠貼合公差 | ± 12 mil (0.3mm) | |
| Stiffener Laminate Tolerance | ± 12 mil (0.3mm) | |
| Solder Mask | Soldermask Dam/Bridge | '± 3 mil (0.08mm) |
| Legend | Trace Width | 5 mil (0.13mm) |
| Surface Finishing | ENIG\Immersion Silver\Gold Plating\Immersion Tin\Tin Plating\Silver Plating\OSP | OK |
| Shaping,Die,Steel Die | Die Tolerance | '± 4 mil (0.1mm) |
| Shaping Tolerance | '± 4 mil (0.1mm) | |
| O/S Test, Impedance Test | OK | |
| Quality Assurance | OK | |
| Packing | Vacuum Bubble Wrap\Zip-loc Bags\Vacuum Shrink Wrap | |