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PCB Capabilities

Flex-Rigld PCB

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Substrate PI + Ra/ED Copper OK
Size Board Size (250 mm × 500 mm) 
Board Thickness Flex:0.1~0.3 mm
Rigid-Flex:0.6~2.4 mm
Trace Width/Spacing Min. 2.5/2.5 mil
Copper Thickness Max. 2 OZ
Min. 1/3 OZ
Flex Board Thickness Max. Thickness 3mil
Min. Thicnkess 0.5mil
Lamination Number of Layers Flex Board:1L~8L
Flex-Rigid:Max. 8L
Drilling Machine Drill Aperture Width Min. 4mil (0.1mm)
Aperture With Tolerance ±0.05mm
Aperture Width Offset ±0.05mm
Laser Drill Min. 4mil (0.1mm)
Plating Aspect Ratio 1:8
COVER LAYER/背膠/Stiffener/Laminate Cover Layer Laminate Tolerance ± 8 mil (0.2mm)
背膠貼合公差 ± 12 mil (0.3mm)
Stiffener Laminate Tolerance ± 12 mil (0.3mm) 
Solder Mask Soldermask Dam/Bridge '± 3 mil (0.08mm) 
Legend Trace Width 5 mil (0.13mm) 
Surface Finishing ENIG\Immersion Silver\Gold Plating\Immersion Tin\Tin Plating\Silver Plating\OSP OK
Shaping,Die,Steel Die Die Tolerance '± 4 mil (0.1mm) 
Shaping Tolerance '± 4 mil (0.1mm) 
O/S Test, Impedance Test   OK
Quality Assurance   OK
Packing Vacuum Bubble Wrap\Zip-loc Bags\Vacuum Shrink Wrap
Trials
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